Connect with us

Hi, what are you looking for?


SK Hynix Champions Innovation, Eyes 3D DRAM to Overcome Microprocessing Boundaries

As the microprocessing capacity of Dynamic Random Access Memory (DRAM) chips reaches its limit, a range of research initiatives is underway to transcend these barriers. SK Hynix has underscored the urgent need for advances in patterning, cell capacitors, and low-resistance wiring, with fresh alternatives such as 3D DRAM being touted as possible successors to microprocessing.

Deokshin Gil, Vice President of SK Hynix, told attendees at the '2023 Next-Generation Memory Process Equipment/Material/Technology Conference', held in Seoul's COEX Tower, "The boundaries of microprocessing in DRAM technology are fast becoming evident, posing significant challenges. To surmount these, we. . .

Please subscribe or login to view.

Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *



You May Also Like