Protech, a leading player in the semiconductor industry, anticipates a surge in sales for its ultra-precision laser bonding equipment used in semiconductor packages, jointly developed with a US-based global second-to-third OSAT (Outsourcing Semiconductor Package Test) company.
The advanced Laser Assisted Bonder (LAB), as it's known in the sector, has been on the wish lists of leading semiconductor firms across the globe. However, the terms of Protech's contract with the OSAT partner had restricted external sales of this highly sought-after equipment. This limitation has recently been lifted, as Protech confirmed on June 5th, saying. . .
