Micron Technology, the American semiconductor company, has revealed plans to kick-start production of 1γ node DRAM (dynamic random-access memory) using extreme ultraviolet (EUV) lithography technology at its Hiroshima factory from 2026. The announcement, made at a press conference held on May 22, 2023, signalled the first instance of EUV lithography equipment being deployed for semiconductor manufacturing in Japan.
Micron's CEO, Sanjay Mehrotra, projected a significant boost to the entire EUV ecosystem in Hiroshima through this initiative. Currently, the company is pursuing certification for the introduction of the EUV equipment, which is expected to be secured by 2024. . .
