In a significant move to bolster energy efficiency in data centres, Marvell Technology is set to introduce high-speed silicon interconnects created using Taiwan Semiconductor Manufacturing Company's (TSMC) revolutionary 3nm process technology. According to Mark Kuemerle, Marvell's Vice President of Technology, this innovation would lead to chiplet connections that drastically reduce power consumption.
The cutting-edge die-to-die (D2D) interconnect designed by Marvell enables data transmission speeds of up to 240T bits per second (bps), a 45% enhancement over the existing interconnects used in multi-chip packages. The company envisages employing this new building block to design. . .
