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Japan’s Semiconductor Ambitions: JOINT2 Consortium Leads Charge in Advanced Packaging Technologies

Japan is taking strategic steps to bolster its semiconductor back-end process industry, following developments in foundry. A particular focus is the enhancement of advanced packaging technologies like 2.5D and 3D. The Japanese semiconductor packaging consortium, JOINT2, is at the helm of this initiative, looking to expand its member base and reinforce partnerships within the country's institutions.

On the 21st ORC Manufacturing, a prominent Japanese semiconductor equipment firm, has enlisted in the JOINT2 consortium, spearheaded by Resonac. Renowned as an optical equipment specialist, ORC Manufacturing primarily manufactures 'Direct Image', an exposure equipment designed for package substrates.

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