The demand for high-performance semiconductors has led to rapid advancements in process miniaturization and the proliferation of 2.5D and 3D packaging. Consequently, the complexity of semiconductor design has increased dramatically. To address this complexity, the industry is actively seeking ways to leverage AI technologies in electronic design automation (EDA) tools, aiming to reduce both development costs and time.
During the recent '2023 Advanced Semiconductor Package Innovation Process Conference' in Seoul, Han Man-yong, managing director of Cadence Korea, highlighted that machine learning-based AI design tools are quickly being commercialized within the semiconductor design arena. This development has. . .
