Connect with us

Hi, what are you looking for?


Infineon and Resonac Strengthen Ties to Accelerate SiC Power Semiconductor Development and Production

On 12 January 2023, Infineon Technologies fortified its relationship with Resonac (formerly Showa Denko) by signing an extended multi-year supply and cooperation agreement concerning silicon carbide (SiC) materials utilised in SiC power semiconductors. This agreement builds upon the sales and co-development deal established in 2021.

In May 2021, Infineon revealed its contract with Resonac, which encompassed a variety of SiC materials, including epitaxy. The new deal serves to complement and augment the initial agreement.

As per the terms of the agreement, Resonac will supply Infineon with the requisite SiC materials for manufacturing SiC power semiconductors, accounting for a. . .

Please subscribe or login to view.

Click to comment

Leave a Reply

Your email address will not be published. Required fields are marked *



You May Also Like


In March 2024, Intel was awarded substantial financial support from the U.S. government under the "CHIPS and Science Act", receiving a combination of subsidies...


In the rapidly evolving field of power electronics, wide bandgap (WBG) semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) are gaining prominence....


On April 25th, the Shenzhou-18 spacecraft, carrying a trio of taikonauts, embarked on a mission to the Tiangong space station after launching from the...


Samsung Electronics Chairman Lee Jae-yong recently visited the headquarters of Zeiss in Oberkochen, Germany, to discuss strengthening cooperation on semiconductor production technologies, specifically within...